Technological Empire Starts From Shanzhai System

  Chapter 345 3D chip stacking technology!

  At this time, in the front row of the auditorium, Motorola President Edward looked at the parameters of the Hantang S2 mobile phone on the projection screen, and his face was very ugly.

  Hantang S2 mobile phone actually has an 8-megapixel IOS optical image stabilization lens, 2GB of super-large running memory, and the mysterious third-generation Hanfeng chip!

   Among them, the most ugly thing for Edward is the Hantang voice input method and artificial intelligence Xiaomeng shown before, because these two things are not available in their Motorola 911 mobile phone!

  The powerful artificial intelligence Xiaomeng and the ultra-high recognition rate of the Hantang voice input method successfully defeated their Motorola's direct screen manipulation method.

  The mobile phone operation method that allows them to directly write text or draw pictures through the screen has become a backward product, because voice recognition is more powerful and more efficient.

   It can be said that just based on the information displayed so far, Edward feels that this Hantang S2 mobile phone is a strong enemy, a strong enemy that can shake the Motorola 911 smartphone!

   Now Edward finally put away his arrogance, and instead looked solemnly at Lin Xuan on the stage, looking at the phone in Lin Xuan's hand!

  At this time, Lin Xuan looked at the surprised eyes on the scene, and he smiled slowly and said:

   "Many sharp-eyed people must have noticed that the artificial intelligence in the mobile phone is smarter and quicker to respond than the computer through my behavior of using the voice input method and artificial intelligence Xiaomeng just now?"

"Ok?"

  Hearing Lin Xuan's question, the people at the scene refocused their attention on the Hantang voice input method and artificial intelligence Xiaomeng.

   Now hearing what Lin Xuan said, people who witnessed all that just now also noticed that the artificial intelligence Xiaomeng in the Hantang S2 mobile phone seems to be a little smarter than the computer's smart housekeeper.

   Moreover, the response speed of the Hantang voice input method seems to be faster than that of the computer. Why is this?

  People who thought of this turned their curious eyes on Lin Xuan, wondering why the response speed on the mobile phone was faster than that on the computer.

   "Actually, the reason for all this is very simple. The reason lies in our Hanfeng third-generation chips and the deeply customized version of the Hantang system."

  As Lin Xuan finished speaking, the screen on the projection screen behind him changed instantly, and a chip architecture diagram appeared in an instant.

   “First of all, let’s talk about the third generation of Hanfeng chips. The third generation of Hanfeng chips are different from the previous generation of Hanfeng and even the first generation of Hanfeng.

  It is the world's first chip with 3D chip stacking technology, and it is also the world's first chip that integrates artificial intelligence AI algorithms into hardware! "

   "3D chip stacking technology and AI algorithm integrated into hardware?!"

  Edward's expression changed.

  Although he is not a technician, it is not easy for him to recognize these two technologies through that noun!

   "Lin Xuan is really not simple, hahaha... Edward, I see how arrogant you are this time."

   At this time, in the front row of the audience, Huang Zicheng, the president of TLC mobile phone company with a calm face, looked at the shocked Edward and sneered in his heart.

   "3D chip stacking technology and the integration of artificial intelligence algorithms into chip circuits?!"

  At this time, in the VIP seats in the front row, Kuke, the representative of Pingguo Company, murmured these two technologies solemnly.

   Regarding these two technologies, Kuke, as Jobs' right-hand man, has naturally heard of the conceptual theory in this area.

   Among them, the concept of 3D chip stacking technology has actually been around for a long time, but because it requires huge scientific research costs to realize 3D stacking technology, and the heat dissipation of stacked chips is indeed a big problem.

  This is equivalent to a chip with only one layer of planar structure directly becoming a multi-layer structure through 3D chip stacking technology.

   In this way, there will definitely be a lot of heat accumulation during the operation of each layer of the chip, because the heat cannot be dissipated.

  So the more layers of chips stacked in this way, the more heat will accumulate, and eventually the chips will collapse and burn before the heat can be dissipated.

  Because 3D chip stacking technology naturally has the defect of poor heat dissipation, although the concept of 3D chip stacking technology has been around for a long time, until now no chip company has specialized in researching this technology.

   After all, in the current era of wild development, the cost of semiconductor companies in various countries to promote the next generation of process technology is not high.

   It has not yet reached the level where several nanometers in later generations need hundreds of billions of dollars to go further.

  So in this era, it is better to develop a more advanced process technology if it spends a huge amount of money to study 3D stacking technology!

   At this time, Kuke heard about this 3D stacking technology from Lin Xuan, and there is also a product with 3D stacking technology, the third-generation chip of Hanfeng.

   That means that Hantang Technology has overcome the natural heat dissipation defect of 3D chip stacking technology, and successfully overcome 3D stacking technology!

   Not good news!

   This means that even though the process technology of Hantang Technology is still at the 45nm level, because of the 3D chip stacking technology, Hantang Technology can pack more transistors within the area of ​​the same chip!

   Hantang Technology, which has mastered the 3D chip stacking technology, can plug more transistors through 3D stacking. The actual chip process technology is definitely not equivalent to 45 nanometers, but more advanced than imagined!

   As for how advanced it is, it depends on how many layers of transistors Hantang Technology can superimpose. The more layers Hantang Technology superimposes, the more transistors there are, and the final performance of the chip will be stronger.

   As for the remaining concept of integrating artificial intelligence algorithms into chip design, Kuke also knows, because Pingguo Company is also developing this technology!

  However, the technology in this area is currently only a special research group, and there is no good news and results yet.

   "3D stacking technology and the integration of artificial intelligence AI technology into chip design?"

  The audience at the scene heard this technical concept, and they seemed to understand the name, but they didn't know what this technology represented.

   "Yes, it is 3D chip stacking technology and the integration of artificial intelligence into chips."

  Lin Xuan nodded slightly, and then continued:

   "The so-called 3D chip stacking technology is to reduce the area of ​​the chip by three-dimensional stacking the previous two-dimensional planar chips.

  You can think of it as building blocks. By pushing up layer by layer, turning the plane into a three-dimensional structure can plug more transistors.

   On small chips such as mobile phone chips, 3D chip stacking technology can play a more powerful role.

   After all, the total area of ​​mobile phones is only so large, so small mobile devices such as mobile phones are most suitable for 3D chip stacking technology! "

  Lin Xuan on the stage talked about this technology calmly, but people at this time did not know how much energy Lin Xuan spent in overcoming the 3D chip stacking technology in the cottage space.

   Among them, the most troublesome thing is the heat dissipation problem of transistors. To be honest, Hantang Technology has nothing to do about this problem. It can only reduce the heat transfer as much as possible and cannot completely eradicate it.

  (end of this chapter)